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| Artikel-Nr.: 5667A-9783319387345 Herst.-Nr.: 9783319387345 EAN/GTIN: 9783319387345 |
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![](/p.gif) | This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems. Weitere Informationen: ![](/p.gif) | ![](/p.gif) | Author: | Luc Claesen; Maria-Teresa Sanz-Pascual; Ricardo Reis; Arturo Sarmiento-Reyes | Verlag: | Springer International Publishing | Sprache: | eng |
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![](/p.gif) | Weitere Suchbegriffe: 3D integration, Analog and mixed signal design, Communication, Computer architecture, Computer hardware, Computer-aided design (CAD), Digital signal processing, Electronic Design Automation (EDA), Logic design, Low-power, Microelectromechanical systems (MEMS) |
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